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C
ONSTELLATION
ES.3 SAS P
RODUCT
M
ANUAL
, R
EV
. C
46
10.2
C
OOLING
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed
temperature conditions specified in Section 6.5.1, "Temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disk assembly
(HDA). You should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section
6.5.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 6.5.1 in which case the drive
should be oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the
electronics and HDA. Also, the shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air
heated by the drive and other heat sources within the rack, cabinet, or drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 18. The air-flow patterns are created by one or
more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are
acceptable as long as the temperature measurement guidelines of Section 6.5.1 are met.
Figure 18.
Air flow
N
OTE
Image is for reference only, may not represent actual drive.
Above unit
nder unit
ote
Air flo s in the direction sho n (back to front)
or in reverse direction (front to back)
Above unit
nder unit
ote
Air flo s in the direction sho n or
in reverse direction (side to side)