Applicable
Materials
Lead-temperature curve
（
common material, such as INTEL
north/south bridge chips
）
Stage
1
2
3
4
5
Top
temperature
area
slope
℃
/S
r1
3
r2
3
r3
3
r4
3
r5
3
Top heating
L1
70
L2
165
L3
185
L4
220
L5
225
Shenzhen SCOTLE Technology
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Email:[email protected] Tel:8675589378931 Alice
http://www.scotle.com/
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4.When reworking 775 and 478 CPU socket, we suggest use the same
size air nozzle with 775 and 478,the air nozzle should toward to 775
tentacle and 478 jack part, and
other parts do not cover the nozzle, this
will achieve
Scotle IR360 PRO V3
BGA Rework Station
Temperature profile:
All of the following curves
，
heating slope r=3.00 Applicable room
temperature 18
～
20
℃，
you can adjust according to the environment
temperature.
