
Confidential and proprietary-the contents in this service guide subject to change without prior notice
Distribution, transmission, or infringement of any content or data from this document without Samsung’s written authorization is strictly prohibited.
7. Level 2 Repair
7-4. Disassembly
※
Caution
Be careful not to damage set and OCTA.
※
Caution
Be care of scratch and molding damage.
※
Caution
Be care of damage to components.
※
Caution
Be careful not to damage the PBA.
1
1) Put the device in the chamber or
Hot plate as below heating condition
-
SOC 68%↓: 70
℃
/10~20min
-
SOC 68%↑: Discharge until 68%↓
※
Please confirm the heating condition
released lastly, and follow it.
2 )Detach the Backglass using disassembl
y jig.
※
Below picture shows how to detach
Back Glass using service jig, however you
can use manufactural jig if possible.
2
Disassemble SIM Tray from device.
Unscrew 13Points.
3
Disassemble the REAR from Front Assy.
4
1. Disassemble Connector 3ea from PBA.
2. Unscrew 1 Points from PBA.
3. Disassemble Coaxial Cable 2ea from PBA.