Samsung P10, Schematic Diagrams

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6 Schematic Diagrams and PCB Silkscreen
6-223 SENS P10
0.1 0401-000191 DIODE-SWITCHING;MMBD4148,75V,200MA,SOT-2 D1 1 V
0.1 0601-000189 LED;CHIP,P/GRN,1.6x2.0mm,557nm USB 1 V
0.1 1003-001491 IC-MEMORY DRIVER;W81386D,LQFP,48P,7X7MM, U1 1 V
0.1 1103-001053 IC-EEPROM;93C46,64x16BIT,SOP,8P,150MIL,1 U2 1 V
0.1 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 R1,R12,R2 3 V
0.1 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 R14,R7 2 V
0.1 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R13,R5 2 V
0.1 2007-000097 R-CHIP;47Kohm,5%,1/16W,DA,TP,1608 R10,R11,R8,R9 4 V
0.1 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R6 1 V
0.1 2007-000659 R-CHIP;27ohm,5%,1/16W,DA,TP,1608 R3,R4 2 V
0.1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C10,C11,C12,C13, 10 V
C14,C17,C18,C20,
C21,C23
0.1 2203-000298 C-CERAMIC,CHIP;10uF,+80-20%,16V,Y5V,TP,3 C19,C22,C5 3 V
0.1 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 C2,C6,C7 3 V
0.1 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160 C1,C16,C8,C9 4 V
0.1 2203-000998 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160 C15,C3 2 V
0.1 2404-001075 C-TA,CHIP;100UF,20%,16V,GP,TP,7343 C4 1 V
0.1 2703-000127 INDUCTOR-SMD;10uH,5%,2.5x3.2x2.2mm L1,L2 2 V
0.1 2801-003689 CRYSTAL-SMD;6MHz,50ppm,28-AAV,12pF,150oh Y1 1 V
0.1 3301-001148 CORE-FERRITE BEAD;AB,60ohm,1.6x0.8x0.8mm B1,B2 2 V
0.1 3709-001223 CONNECTOR-CARD EDGE;10P,-,SMD-A,AU J2 1 V
0.1 3711-000922 CONNECTOR-HEADER;BOX,4P,1R,1.25mm,SMD-A, J1 1 V
0.1 BA39-00272A CBF HARNESS;TAURUS,-,-,4P,35MM,WHITE,-,- PCB 1 V
0.1 BA41-00298A PCB;TAURUS,SMB-2000W,EPOXY,2 LAYER,1.0,T PCB 1 V
0.1 BA68-40005L LABEL-BARCODE;COMPUTER,-,-,-,40*6,WHT,PB PCB 1 E
LEVEL CODE Description and Specification Location Q’ty
6-12-3 Parts List