3-5
Disassembly and Reassemble
Description
Picture Description
Screws
15
After lifting the top portion of the board,
disassemble the terminal part attached to
the bottom.
16
Check the attachment status of the GaP
pad during decomposition.
decomposition complete.
※
GAP PAD imprints must be carefully
assembled when reassembling. Heat
generation may occur during misassembly.
17
[JOG PCB DISASSEMBLY]
Disassemble FUNCTION by lifting it in the
direction of the arrow.
Summary of Contents for Odyssey G7 LC27G7 T Series
Page 36: ...4 3 Troubleshooting Location of Parts Main Board ...
Page 38: ...4 5 Troubleshooting Location of Parts Main Board ...
Page 40: ...4 7 Troubleshooting Location of Parts Main Board ...
Page 42: ...4 9 Troubleshooting Location of Parts Main Board ...
Page 57: ...4 24 Troubleshooting 3 Execute Auto Program 4 The WinISP input will be completed ...
Page 61: ...5 1 Wiring Diagram 5 Wiring Diagram 5 1 Wiring Diagram ...
Page 62: ...5 2 Wiring Diagram 5 2 Block Diagram ...
Page 63: ...5 3 Wiring Diagram 5 3 Board Connection Main Board ...