Samsung NP-R40, Manual

Page: 47 / 148

Samsung
Confidential
SAMSUNG
- Place a ground plane under the traces.
A
3
B
CPU Thermal Sensor
2
1
SAMSUNG ELECTRONICS CO’S PROPERTY.
FAN Control Logic
- Keep traces away from fast data buses and CRT signal.
4
4
- Use guard traces flanking DXP and DXN and connecting to GND
Refer To Thermal Sensor Layout Guidelines.
Line Width = 20 mil
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
C
B
3
1
ELECTRONICS
D
SAMSUNG PROPRIETARY
- Place the Thermal Sensor close to a remote diode.
PROPRIETARY INFORMATION THAT IS
2
- Keep traces away from high voltage (+12V bus)
C
600mA
D
FAN Connector
THIS DOCUMENT CONTAINS CONFIDENTIAL
A
- Use recommended trace widths and spacings (10mil)
MICOM_P3.3V
21-C3 51-B2
R586
2K
L505
10uH
P3.3V_AUX
1%
10K
R120
C141
2.2nF
C140
100nF
2.2K
10-C4 51-B2
R117
100
2.2K
R118
MMBT3904
Q522
1
3
2
R532
D506
MBR0540
21
R588
10K
nostuff
P5.0V
VCCP
51-D2 36-C3
6.3V
C544
10000nF
nostuff
R115
0
MICOM_P3.3V
R116
10K
C139
100nF
GND
HYST
1 5
OS*
V+
4
VTEMP
3
0
R119
nostuff
DMINUS
2
DPLUS
5
GND
8
SMBCLK
7
SMBDATA
T_CRIT_A*
4
VDD
1
U6
LM26CIM5X-TPA
2
12-B3 51-A3
U7
W83L771W/G
ALERT*
6 3
HDR-2P-SMD
J504
3711-000541
1
2
51-C3
12-A3 51-A3
46-C3 51-C4
MICOM_P3.3V
ELM7S08WS
U5
nostuff
+
5
3
-
1
2
4
FDC653N
Q506
D1
1
2
D2
5
D3
D4
6 3
G
4
S
MICOM_P3.3V
P3.3V
100K
R531
51-A2
51-C3
56
R587
10-C4 51-D2
51-D4 22-B1
51-A2 36-B3
36-C3
KBC3_FANCTRL
CPU2_THERMDA
CPU2_THERMDC
CHP3_OVERT#
THRM_ALERT#
OTP3_OVERT#
KBC3_THERM_SMCLK
KBC3_THERM_SMDATA
CPU1_THRMTRIP#
THRM_ALERT#
THERM_STP#
OTP3_OVERT#
CHP3_SBTHRMTRIP#
51-D2 10-C4