Samsung Msys-5100P, Service Manual

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2007-000338 R53 1 R-CHIP “120KOHM,5%,1/10W,DA,TP,2012”
2007-000395 R96 1 R-CHIP “150KOHM,5%,1/10W,DA,TP,2012”
2007-000457 R39 1 R-CHIP “18KOHM,5%,1/10W,DA,TP,2012”
2007-000586 R63 1 R-CHIP “22KOHM,5%,1/10W,DA,TP,2012”
2007-000642 R40 1 R-CHIP “270OHM,5%,1/10W,DA,TP,2012”
2007-000703 R88 1 R-CHIP “3.6KOHM,5%,1/10W,DA,TP,2012”
2007-000710 R38 1 R-CHIP “3.9KOHM,5%,1/10W,DA,TP,2012”
2007-000738 R82 1 R-CHIP “30KOHM,5%,1/10W,DA,TP,2012”
2007-000766 R100 1 R-CHIP “330OHM,5%,1/10W,DA,TP,2012”
2007-000766 R101 1 R-CHIP “330OHM,5%,1/10W,DA,TP,2012”
2007-000798 R46 1 R-CHIP “360OHM,5%,1/10W,DA,TP,2012”
2007-000859 R57 1 R-CHIP “4.3KOHM,5%,1/10W,DA,TP,2012”
2007-000872 R86 1 R-CHIP “4.7KOHM,5%,1/10W,DA,TP,2012”
2007-000931 R47 1 R-CHIP “470OHM,5%,1/10W,DA,TP,2012”
2007-000941 R119 1 R-CHIP “47KOHM,5%,1/10W,DA,TP,2012”
2007-000941 R120 1 R-CHIP “47KOHM,5%,1/10W,DA,TP,2012”
2007-000941 R97 1 R-CHIP “47KOHM,5%,1/10W,DA,TP,2012”
2007-000947 R107 1 R-CHIP “47OHM,5%,1/10W,DA,TP,2012”
2007-001097 R48 1 R-CHIP “62KOHM,5%,1/10W,DA,TP,2012”
2007-001118 R44 1 R-CHIP “680OHM,5%,1/10W,DA,TP,2012”
2007-001118 R45 1 R-CHIP “680OHM,5%,1/10W,DA,TP,2012”
2007-001118 R65 1 R-CHIP “680OHM,5%,1/10W,DA,TP,2012”
2007-001201 R41 1 R-CHIP “820OHM,5%,1/10W,DA,TP,2012”
2203-000192 C35 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C36 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C37 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C38 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C40 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C42 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C76 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C79 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000239 C47 1 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000239 C48 1 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000260 C14 1 “C-CERAMIC,CHIP” “10nF,10%,50V,X7R,TP,2012”
2203-000444 C43 1 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,2012,-”
2203-000444 C45 1 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,2012,-”
2203-000444 C46 1 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,2012,-”
2203-000989 C53 1 “C-CERAMIC,CHIP” “47nF,10%,50V,X7R,TP,2012”
2203-000989 C54 1 “C-CERAMIC,CHIP” “47nF,10%,50V,X7R,TP,2012”
2203-002442 C75 1 “C-CERAMIC,CHIP” “330nF,+80-20%,25V,Y5V,TP,2012”
2301-001027 C64 1 “C-FILM,PEF” “15nF,10%,250V,TP,9.5x12x4.5,5m”
2305-000505 C63 1 “C-FILM,MPEF” “1uF,10%,250V,BK,6x8.5x14.5,15m”
2305-001024 C78 1 “C-FILM,MPEF” “33nF,10%,250V,BK,10.5x3.5x6.5,”
2401-000026 C56 1 C-AL “3.3UF,20%,50V,GP,TP,5X11,5”
2401-000026 C69 1 C-AL “3.3UF,20%,50V,GP,TP,5X11,5”
2401-000042 C1 1 C-AL “100uF,20%,16V,GP,TP,6.3x7,5”
2401-000042 C2 1 C-AL “100uF,20%,16V,GP,TP,6.3x7,5”
2401-000414 C68 1 C-AL “10uF,20%,16V,GP,TP,4x7,5”
2401-000486 C77 1 C-AL “10uF,20%,50V,GP,TP,6.3x7mm,5”
2401-000597 C4 1 C-AL “1uF,20%,50V,GP,TP,4x7mm,1.5mm”
2401-000958 C74 1 C-AL “22uF,20%,50V,BP,-,10x12.5mm,5m”
2401-001082 C67 1 C-AL “330nF,20%,50V,GP,TP,5x11,5”
2401-001775 C57 1 C-AL “470nF,20%,50V,GP,TP,4x7,5”
3501-001153 RE1 1 RELAY-MINIATURE “5VDC,200MW,2000MA,2FORMC,4MS,4MS”
Electrical Parts List
SEC CODE LOCATION NO. Q’ty DESCRIPTION
Samsung Electronics 7-18
LIU PBA(JC92-01192D)