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Precautions
Samsung Electronics
Service Manual
1-5
1.3 ESD Precautions
Certain semiconductor devices can be easily damaged by static electricity. Such components are commonly called
“Electrostatically Sensitive (ES) Devices”, or ESDs. Examples of typical ESDs are: integrated circuits, some field
effect transistors, and semiconductor “chip” components.
The techniques outlined below should be followed to help reduce the incidence of component damage caused by
static electricity.
Caution >>Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
1. Immediately before handling a semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known earth ground. Alternatively, employ a commercially avail-
able wrist strap device, which should be removed for your personal safety reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ESDs, place the assembly on a conductive surface, such as
aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the assem-
bly.
3. Use only a grounded tip soldering iron to solder or desolder ESDs.
4. Use only an “anti-static” solder removal device. Some solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ESDs.
5. Do not use Freon-propelled chemicals. When sprayed, these can generate electrical charges sufficient to dam-
age ESDs.
6. Do not remove a replacement ESD from its protective packaging until immediately before installing it. Most
replacement ESDs are packaged with all leads shorted together by conductive foam, aluminum foil, or a compa-
rable conductive material.
7. Immediately before removing the protective shorting material from the leads of a replacement ESD, touch the pro-
tective material to the chassis or circuit assembly into which the device will be installed.
8. Maintain continuous electrical contact between the ESD and the assembly into which it will be installed, until com-
pletely plugged or soldered into the circuit.
9. Minimize bodily motions when handling unpackaged replacement ESDs. Normal motions, such as the brushing
together of clothing fabric and lifting one’s foot from a carpeted floor, can generate static electricity sufficient to
damage an ESD.
1. Exercise caution when replacing a super capacitor or Lithium battery. There could be a danger of explosion and
subsequent operator injury and/or equipment damage if incorrectly installed.
2. Be sure to replace the battery with the same or equivalent type recommended by the manufacturer.
3. Super capacitor or Lithium batteries contain toxic substances and should not be opened, crushed, or burned for
disposal.
4. Dispose of used batteries according to the manufacture’s instructions.
1.4 Super Capacitor or Lithium Battery Precautions
Summary of Contents for CLP 600N - Color Laser Printer
Page 5: ...Continued ...
Page 38: ...System Overview Samsung Electronics Service Manual 3 21 1 2 27 28 HRS 2 0mm 2R 22PIN Straight ...
Page 48: ...S W Structure and Descriptions Samsung Electronics Service Manual 4 5 ...
Page 55: ...Disassembly and Reassembly Samsung Electronics Service Manual 5 7 ...
Page 56: ...Samsung Electronics Service Manual Disassembly and Reassembly 5 8 ...
Page 57: ...Disassembly and Reassembly Samsung Electronics Service Manual 5 9 ...
Page 149: ...Exploded Views Parts List Service Manual 8 7 8 3 Top Cover 0 1 2 3 4 5 6 7 8 ...
Page 167: ...Exploded Views Parts List Service Manual 8 25 8 11 Guide Paper 0 1 2 3 4 4 4 5 6 7 8 9 10 11 ...
Page 184: ...Samsung Electronics Service Manual Block Diagram 9 2 9 2 16ppm Block Diagram ...
Page 185: ...Block Diagram Samsung Electronics Service Manual 9 3 9 3 GID H W Block Diagram ...
Page 186: ...Samsung Electronics Service Manual Block Diagram 9 4 9 4 N C Wireless Block Diagram ...
Page 189: ...Connection Diagram Samsung Electronics Service Manual 10 3 10 3 Main SMPS ...
Page 190: ...Samsung Electronics Service Manual Connection Diagram 10 4 10 4 Main Driver HVPS 28 pin ...
Page 191: ...Connection Diagram Samsung Electronics Service Manual 10 5 10 5 Main Driver HVPS 8 pin ...
Page 192: ...Samsung Electronics Service Manual Connection Diagram 10 6 10 6 Main Driver DF11 28 pin ...
Page 193: ...Connection Diagram Samsung Electronics Service Manual 10 7 10 7 Main System thermistor 2 pin ...
Page 194: ...Samsung Electronics Service Manual Connection Diagram 10 8 10 8 Main SET CTD CR CRUM sensor ...
Page 195: ...Connection Diagram Samsung Electronics Service Manual 10 9 10 9 Main Temp Hum sensor 4 pin ...
Page 196: ...Samsung Electronics Service Manual Connection Diagram 10 10 10 10 Main LSU 24 pin ...
Page 197: ...Connection Diagram Samsung Electronics Service Manual 10 11 10 11 Main LSU 5 pin motor ...
Page 200: ...Samsung Electronics Service Manual Connection Diagram 10 14 10 14 Main BLDC 10 pin ...
Page 201: ...Connection Diagram Samsung Electronics Service Manual 10 15 10 15 Driver OPC Step motor 8 pin ...
Page 203: ...Connection Diagram Samsung Electronics Service Manual 10 17 10 17 Driver MP Empt sensor ...
Page 204: ...Samsung Electronics Service Manual Connection Diagram 10 18 10 18 Main OP Panel 5 pin ...
Page 205: ...Connection Diagram Samsung Electronics Service Manual 10 19 10 19 Main Deve CRUM I F 3 pin ...
Page 206: ...Samsung Electronics Service Manual Connection Diagram 10 20 10 20 SMPS 24V micro switch 2 pin ...