Chapter 1: Introduction
Subsystem Components
1-5
connectors are on located on the controller’s faceplate. (See
Section 1.2.2
)
•
BBU module:
An optional BBU module sustains unfinished writes
cached in memory during a power outage in order to prevent data
loss. (See
Section 1.2.5
)
•
PSU modules:
The hot-swappable PSUs receive single-phase
power and d5V, +12V, and +3.3V power to the subsystem.
A power switch is located on each PSU to turn the system on and
off. (See
Section 1.2.6
)
•
Cooling modules:
The redundant cooling modules ventilate the
subsystem to maintain a cooling airflow across the subsystem. (See
Section 1.2.7
)
1.1.2.6 Backplane
Board
An internal backplane board separates the front and rear sections of the
GHDX2-2130-16iSCSI. The PCB board consists of traces for logic level
signals and low voltage power paths. It contains no user-serviceable
components.
WARNING!
When inserting a removable module, DO NOT USE EXCESSIVE
FORCE! Forcing or slamming a module can damage the pins on the
module connectors either on the module itself or on the backplane. Gently
push the module until it reaches the end of module slot. Feel the contact
resistance and use slightly more pressure to ensure the module connectors
are correctly mated. If the module comes with ejection levers or retention
screws, use them to secure the module.
1.2 Subsystem
Components
The GHDX2-2130-16iSCSI houses many active components and most of
them can be accessed through either the front or rear panel. The modular
design of the active components facilitates their easy installation and
removal. Hot-swap mechanisms are incorporated to eliminate power surges
and signal glitches that might occur while removing or installing these
modules.
