ICP-S Technical Manual
Overcurrent Protection Elements
Rev.A
11/13
8. Application Circuit Example
8-1 Recommended Flow Soldering Conditions
8-2 Recommended Reflow Soldering Conditions
8-3 Recommended Copper Pattern on PCB
25
50
100
100
°
C
(
°
C)
Preheating
Soldering
Manual soldering conditions
Soldering iron temperature: 350
°
C max.
Soldering time: 3 seconds max.
Solder temper
ature
Natural cooling
120
°
C
2 minutes min.
5 minutes min.
1 minute min.
10 seconds min.
230
°
C
260
°
C
150
200
250
300
0
50
100
(
°
C)
Preheating
speed
A peak temperature of at least 230
°
C is recommended. If the peak temperature is less than 230
°
C, it is recommended to
make some adjustments, such as the retention of the peak temperature and soldering time longer and an increase in the thickness
of solder paste.
T
emper
ature
1 to 5
°
C / sec
Preheating
120 to 160
°
C,
50 to 120 sec
Peak temperature
230 to 260
°
C, 10sec Max.
Cooling
60sec Min.
∗
Number of reflow times: 2 TIMES Max.
Reflow soldering
(High-temperature
retention time)
200
°
C,
30 to 60 sec
Reflow heating temperature
1 to 5
°
C / sec
150
200
250
1.8 to 2.4
1.6 to 2.0
4.0 to 5.0
