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Rockwell Automation Publication 1718-IN001A-EN-E - June 2020
1718 Ex I/O
Maximum Number of I/O Modules
The power consumption of the I/O modules, adapter, and power supplies can be
found in the Technical Data publication,
. For some devices, the
technical data provides power dissipation information in addition to the power
consumption. This specifies the power that is converted into heat in the device
and is important for the calculation of heat in the enclosure. If the power
dissipation is not specified in the technical data, the power dissipation is
calculated using the value of the power consumption.
WARNING:
Explosion hazard through power overload
Excessively high power can cause the maximum permissible temperature within
the enclosure and the maximum permissible surface temperature of the
enclosure to be exceeded.
Perform a heat calculation to determine the maximum number of I/O modules.
Do not install additional loads if the maximum permissible number of I/O
modules is installed in the enclosure.
IMPORTANT
The maximum number of I/O modules that can be installed, taking into
account the temperature class, is determined by the permissible power
dissipation in the enclosure. If, in addition to the 1718 Ex I/O, other loads
are installed, their power consumption may reduce the power available
to the 1718 Ex I/O. Use only the approved configuration for the enclosure
selected.
