( 13 / 52 )
Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Terminology ............................................................................................................................... 14
2.2 Package Components.................................................................................................................. 15
2.3 Other Tool Products Required for Development........................................................................ 15
2.4 Name of Each Part ...................................................................................................................... 16
(1) System Configuration ........................................................................................................... 16
(2) Inside of the Emulation Pod.................................................................................................. 17
2.5 When Using the Emulator for the First Time ............................................................................. 18
Summary of Contents for Single-Chip Microcomputer M37900T2-RPD-E
Page 6: ... 6 52 MEMO ...
Page 12: ... 12 52 MEMO ...
Page 28: ... 28 52 MEMO ...
Page 36: ... 36 52 MEMO ...
Page 40: ... 40 52 MEMO ...
Page 50: ... 50 52 MEMO ...
Page 52: ......