RZ/A2M SUB Board RTK79210XXB00000BE
2. Function specifications
R20UT4398EJ0100 Rev.1.00
2-23
2018.10.11
2.3.2
NAND Flash Memory Interface
RTK79210XXB00000BE is possible to mount NAND flash memory x 1 shown in Table 2.3.6 on the board pattern.
NAND flash memory control is performed by the RZ/A2M on-chip NAND flash controller
(
FLCTL).
Figure 2.3.2 shows NAND flash memory interface block diagram, and Table 2.3.7 shows the function settings of the
system setting DIP switches SW6-5 and SW6-6.
Table 2.3.6
NAND Flash Memory Overview
Model name
Bus size
Capacity
Access time
S34ML01G100TFI000
8 bit
128 MBytes
(8 bit x 128 M word)
Random: 25
μs (max.
)
Sequential: 25 ns (min.
)
Figure 2.3.2
NAND Flash Memory Interface Block Diagram
PK_4
14
PK_0
PK_3
P3_4
PK_2
P3_1
P3_2
P3_5
P3_3
PK_1
PH_5
Ether2 /
NAND
（
U14
）
Ether2 /
NAND
（
U17
）
Ether2 /
NAND
（
U19
）
FWE
FRE
FRB
FALE
14
11
To EthernetPHY2
P3_3
P3_2
P3_4
P3_1
PK_1
PH_5
PK_0
P3_5
PK_2
PK_3
NAND flash memory
（
U31
）
NAF[7:0]
FCE
CE#
I/O[7:0]
FALE
FRE
FCLE
FRB
ALE
CLE
RE#
R/B
3.3V
FWE
WE#
WP#
3.3V
PK_4
NAF1
PJ_7
PJ_6
RZ/A2M (U1)
PK_4 / ET1_RXD0/RMII1_RXD0 /
NAF7
P3_5 / ET1_RXD1/RMII1_RXD1 /
FCLE
P3_1 / ET1_RXER/RMII1_RXER /
FALE
P3_2 / ET1_CRS/RMII1_CRSDV /
FRE
P3_3 / ET1_MDC /
FWE
P3_4 / ET1_MDIO /
FRB
PK_1 / ET1_TXD0/RMII1_TXD0 /
NAF4
PK_3 / ET1_RXCLK/REF50CK1 /
NAF6
PH_5 /
NAF2
/ ET1_EXOUT
PK_2 / ET1_TXD1/RMII1_TXD1 /
NAF5
PK_0 / ET1_TXEN/RMII1_TXDEN /
NAF3
PK_5 /
NAF1
PJ_7 /
NAF0
/ LCD0_EXTCLK
PJ_6 /
FCE
/ LCD0_CLK
LCD /
NAND
（
U15
）
PJ_6
PJ_7
MUX
OE#
S
4A
4B1
4B2
3A
3B1
3B2
2A
2B1
2B2
1A
1B1
1B2
NAF 3
NAF 2
NAF 4
FCLE
MUX
OE#
S
4A
4B1
4B2
3A
3B1
3B2
2A
2B1
2B2
1A
1B1
1B2
NAF 7
NAF 6
NAF 5
MUX
OE#
S
3A
3B1
3B2
2A
2B1
2B2
1A
1B1
1B2
FCE
NAF 0
2
To LCD I/F
3.3V
3.3V
MUX
OE#
S
2A
2B1
2B2
1A
1B1
1B2
3.3V
DIP
SW6-6
3.3V
OFF
3.3V
3.3V
NAF 1
Note:
Red text
indicates a function used.
：
Indicates a function not implemented.
：
indicates a SUB board.
ON(L):A=B1, OFF (H): A= B2
DIP
SW6-5
OFF
3.3V
