PIRA32 Microcontroller
© 2016 Pira.cz
m32.pdf - page 15
5.2
28-Lead Plastic Small Outline
– Wide, 300 mil Body (SOIC)
Units
MILLIMETERS
Dimension Limits
MIN
TYP
MAX
Number of Pins
n
28
Pitch
p
1.27
Overall Height
A
2.36
2.50
2.64
Molded Package Thickness
A2
2.24
2.31
2.39
Standoff §
A1
0.10
0.20
0.30
Overall Width
E
10.01
10.34
10.67
Molded Package Width
E1
7.32
7.49
7.59
Overall Length
D
17.65
17.87
18.08
Chamfer Distance
h
0.25
0.50
0.74
Foot Length
L
0.41
0.84
1.27
Foot Angle Top
0°
4°
8°
Lead Thickness
c
0.23
0.28
0.33
Lead Width
B
0.36
0.42
0.51
Mold Draft Angle Top
0°
12°
15°
Mold Draft Angle Bottom
0°
12°
15°
Notes:
§ Significant Characteristic
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010”
(0.254mm) per side.
