深圳市远景达物联网技术有限公司
Shenzhen RakindaTechnology Co., Ltd.
6 / 13
2.2.
Main Hardware Components
1 TOF camera module
1VCSELlaser
1RGBcameramodule
1dedicatedASICprocessingchip
1 control motherboard (including CPU, FLASH, etc.)
2.3.
Product Structure & Size
（
Unit
：
mm
）
M5 modulestructure & size
：
Figure
2 M5
structure & size
1. Fixing Instruction
(1)
If the customer's product is a metal material, the module can be fixed to the product through two
fixed steel sheets on the module. Customer can design the limit structure according to the internal
structure of the product to facilitate assembly, and also prevent assembly deviations from causing
deviations between the lens and the glass transparent area.
