17
9. RadiSys
recommends
you
place
the
assembly
in
a
temperature
chamber
at
a
temperature
of
60ºC
for
10
minutes
to
allow
the
thermal
interface
material
to
phase
change
and
conform
to
an
optimal
shape
between
the
chips
and
heatsink.
As
an
alternative
to
using
a
temperature
chamber,
you
can
perform
this
step
immediately
after
assembling
the
system
by
temporarily
covering
the
heatsink
to
trap
heat
and
elevate
the
temperature.
To
verify
that
the
temperature
reaches
60ºC,
enter
the
BIOS
Setup
utility
by
pressing
F2
during
system
boot,
and
navigate
to
the
Information
>
System
Monitors
submenu.
After
10
minutes
of
operation
at
60ºC,
be
sure
to
uncover
the
heatsink
before
using
the
system
further.
W
ARNING
!
The CPU may be damaged if this step is not performed prior to operating the
system.
This
completes
the
assembly
of
the
module
and
heatsink.
Install the module and heatsink assembly onto the carrier board
1. Line
up
the
board
‐
to
‐
board
‐
carrier
interconnectors
on
the
module
and
the
CR100
carrier
board,
then
press
the
connectors
firmly
into
place.
When
the
module
is
fully
seated,
its
five
standoffs
should
be
touching
the
CR100
carrier
board.
W
ARNING
!
To avoid damaging any component, make sure the COM Express module is firmly
seated in the CR100 board’s interconnectors before using screws to complete the assembly.
Board-to-board
interconnector
