USER MANUAL
3
2.2.
Characteristics
3 Memory locations
Digital calibration function
Automatic standby and hibernation
Constant temperature thanks to closed loop control
Automatic cooling system
Lightweight handle
2.3.
Specification
Power
580W
Display
LED (resolution 1
℃
)
Airflow
Max. 40/min
Temperature range 100 – 500 °C
Heating element
Ceramic Heating element
Dimension
110mm(W)×151mm(L)×180mm(H)
Weight
1.6kg
2.4.
Application
1.
It is suitable for soldering and desoldering various kinds of components
such as SOIC, QFP, PLCC, BGA chips.
2.
It is suitable for heat shrinkage, paint and sticker removal, preheating,
sterilizing, glue connecting etc.