HSPA/UMTS/GSM/GPRS Module Series
UG96&UG95&M95 R2.0 Compatible Design
UG96&UG95&M95 R2.0_Compatible_Design
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Table 5: Recommended Thermal Profile Parameters
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours
’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the 2D barcode is still readable, although white rust may be found.
6.2. Packaging
UG96, UG95 and M95 R2.0 modules adopt tape and reel packaging and are stored in a vacuum-sealed
bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered
onto the application.
The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.
Factor
Recommendation
Soak Zone
Max slope
1 to 3°C/sec
Soak time (between A and B: 150°C and 200°C)
60 to 120 sec
Reflow Zone
Max slope
2 to 3°C/sec
Reflow time (D: over 220°C)
40 to 60 sec
Max temperature
240°C~245°C
Cooling down slope
1 to 4°C/sec
Reflow Cycle
Max reflow cycle
1
NOTES
