UMTS/HSPA Module Series
UG95 Hardware Design
UG95_Hardware_Design Confidential / Released 63 / 72
It is suggested that peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). Absolute max
reflow temperature is 260ºC. To avoid damage to the module when it was repeatedly heated, it is
suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
Time
50
100
150
200
250
300
50
100
150
200
250
160
ºC
200
ºC
217
0
70s~120s
40s~60s
Between 1~3
ºC
/s
Preheat
Heating
Cooling
ºC
s
Liquids Temperature
Figure 41: Reflow Soldering Profile
Quectel
Confidential