Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 22 / 139
1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
out
might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of SC66 and illustrates the major functional parts.
Power management
Radio frequency
Baseband
eMMC flash
Peripheral interfaces
-- USB interfaces
-- (U)SIM interfaces
-- UART interfaces
-- SD card interface
-- GPIO interfaces
-- I2C interfaces
-- ADC interfaces
-- LCM (MIPI) interfaces
-- TP (touch panel) interfaces
-- Camera (MIPI) interfaces
-- Audio interfaces
-- I2S interfaces
-- SPI interface
NOTES
