Smart Module Series
SC262R_Series_Hardware_Design 68 / 115
MIC3_P
33 pF
MEMS MIC
R2
R1
C2
Module
MIC_ GND
0R
C1
MIC_BIAS1
1
2
3
4
F1
D1
OUT
GND
GND
VDD
100 nF
C4
0R
33 pF
Figure 25: Reference Circuit Design for MEMS Microphone Interface
3.22.2. Reference Circuit Design for Earpiece Interface
EAR_P
EAR_N
R2
33 pF
33 pF
33 pF
C2
C3
C1
R1
Module
D1
D2
0R
0R
Figure 26: Reference Circuit Design for Earpiece Interface
3.22.3. Reference Circuit Design for Headset Interface
20K
ESD
MIC_GND
MIC2_P
HPH_L
HS_DET
HPH_R
HPH_REF
33 pF
Module
R1
0R
6
3
4
5
2
1
33 pF 33 pF
C3
C4
C5
F3
F2
F1
D1 D2 D3 D4
F4
R2
R3
0R
Figure 27: Reference Circuit Design for Headset Interface