![Quectel LTE Standard Module Series Hardware Design Download Page 13](http://html1.mh-extra.com/html/quectel/lte-standard-module-series/lte-standard-module-series_hardware-design_3604632013.webp)
LTE Standard Module Series
EG21-G Mini PCIe Hardware Design
EG21-G_Mini_PCIe_Hardware_Design 12 / 54
1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P
out
might reduce in their value and exceed the specified tolerances. When the temperature
returns to normal operation temperature levels, the module will meet 3GPP specifications again.
3.
“*” means under development.
Data update rate: 1Hz by default
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Physical Characteristics
Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm
Weight: approx. 9.8g
Temperature Range
Operation temperature range: -35°C ~ +75°C
1)
Extended temperature range: -40°C ~ +80°C
2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Upgrade via USB interface or DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES