LTE Module Series
EM05 Hardware Design
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The thermal dissipation area is shown as below. The dimensions are measured in mm.
Bottom View
26.2
15.8
Thermal dissipation area
Figure 31: Thermal Dissipation Area on Bottom Side of the Module
The table below shows the heat dissipation performance after adding a heat sink between the module
and the main PCB.
Table 33: Heat Dissipation Performance
The test condition is: under ambient temperature 70°C with LTE Band 8, BW=20M and max power.
Scenario
Testing Time
Temperature
Baseband
PA
Unit
No heat sink
15 minutes
112
112
°C
Add a heat sink
15 minutes
90
89
°C
NOTE
Quectel
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