NB-IoT Module Series
BC65 Hardware Design
BC65_Hardware_Design 51 / 55
Table 26: Recommended Thermal Profile Parameters
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
7.3. Packaging
The modules are stored in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.
7.3.1. Tape and Reel Packaging
The reel is 330 mm in diameter and each reel contains 250 modules.
Factor
Recommendation
Soak Zone
Max slope
1 to 3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70
–120 s
Reflow Zone
Max slope
2 to 3 °C/s
Reflow time (D: over 220 °C)
45
–70 s
Max temperature
238 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTES
