Chapter 1
17
ECX-APL0 Series User’s Manual
Product Specifications
Model Name
ECX-APL0 Series
Form Factor
ECX, 146x105mm (5.75" x 4.13")
CPU Support
Intel® Apollo Lake SoC Processors
Memory
2x DDR3L SO-DIMM memory socket
Displays
1x LVDS
1x HDMI1.4 (on rear)
1x DP1.2 (on rear)
Audio Chipset
Realtek ALC662
Audio Interfaces
2x Speaker-out (3W)
1x Line-in (by header)
1x Line-out (by header)
1x Mic-in (by header)
Ethernet
2x GbE LAN (RJ-45 on rear, Intel® I210-AT)
USB
4x USB3.0 (Type A on rear)
2x USB2.0 (by header)
Serial Ports
2x RS-232/422/485 (by wafer, auto flow control function for RS-485)
4x RS-232 (by wafer)
Other I/O Ports
1x 8-bit DIO (by header)
Storage &
Expansion
1xSATA3.0 (2x by BOM option in case of eliminating M.2 SATA support)
1x Micro SD Cage (on front)
1x mPCIe Socket (full size)
1x M.2 Key B (mixed with USB2.0 / SATA type 22x42)
1x SIM card wafer (switchable between mPCIe and M.2)
Power
Connector: 1x4-pin Wafer (straight & right angle dual-footprint)
Input Voltage: DC 12V
BIOS
AMI uEFI BIOS w/ 128Mb SPI Flash
Watchdog
Programmable WDT to generate System reset event
Hardware Monitor
Voltages monitoring
Temperature monitoring
Real Time Clock
Processor integrated RTC
TPM
optional
System Control &
Monitoring
1x Header Reset button, HDD LED & External Speaker
1x Header for Power button, Power LED & SM bus
1x Header for mPCIe activity LED
1x Header for M.2 activity LED
Cooling
1x Wafer for System Smart Fan
Environmental
Characteristics
Operation Temp.: 0°C ~ 60°C / 32°F ~ 140°F
Storage Temp.: -20°C ~ 80°C / -4°F ~ 176°F
Humidity: 0% ~ 95%
Certifications
CE, FCC Class A
Table 1 Product Specifications