LED SMT Reflow Oven T-960e
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2. To the cooling oven, should be preheated for 15-20 minutes.
3. When the temperature is stable, let PCB board pass heat reflow system. Un
der this set, the solder paste can reach the reflow critical point. If there isno r
eflow, to operate as step 4. If the reflow is too fast, please keep correctproport
ion to increase or reduce the temperature. And let the PCB pass the system a
gain until reach the reflow critical point. Then turn to step 4, only when there
is reflow that is good.
4. If there is no reflow, please reduce the belt speed. For example, now the belt speed
is 500mm/min, please adjust it to about 460mm/min. Usually, reduce the speed 10%
can increase the temperature about 30F. Another way is that, do not adjust the speed,
and increase the temperature properly. The increase range standard is the temperature
wave. Adjust the temperature on the basis difference between PCB actual and standard
temperature. The adjust range is about 5
℃
.When adjust the temperature, it can not
exceed the PCB and component bearing capacity.
5. Let the PCB board pass the reflow system in the new speed or new set temperature.
If there is no reflow, back to step 4 to adjust again. Or carry out the step 6 for
temperature fine-turning.
6. The heat temperature wave is adjustable according to the PCB board. You can adjust
the transmission belt speed to adjust the temperature. Reduce the belt spend can
increase the product heat temperature. On the contrary, you can reduce the product
heat temperature.
7. Attention: if there is components on the PCB, the PCB pass the reflow and it reflow