LED SMT Reflow Oven T-960e
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7
temperature heats up and the solder paste melts. When PCB board goes in to cooling
area, the liquid solder paste the soldering points solidify. The reflow process is
finished.
The temperature is the key to welding quality. The actual and the setting temperature
warming slope and the peak temperature should be accordant. Before the
temperature reaches 160
℃
, please control the heat up speed in about 1
℃
/S. If heat
up too quickly, the PCB board and the components will be damaged, and the PCB
board may be out of shape. On the other side, the flux volatilizes too fast. And it is
easy to make soldering tin ball. Set the peak temperature 20
℃
-40
℃
higher than the
solder paste melting point. Set the reflow time 10S-60S. If the peak temperature is
low or the reflow time is short, it will affect the welding quality, and serious is
causing the solder paste does not melt. If the peak temperature is high or the reflow
time is long, the metal power will be oxidized and affect the welding quality and
serious is causing the component and PCB board damaged.
2. The set of the temperature wave
Set the wave according to the solder paste and the above foundation. Different solder
paste, choose and set different waves. In addition, the temperature wave has related
to the PCB, the density and size of components. Generally lead-free welding
temperature should be higher 40
℃
than melting point.
Temperature Area Set
1. Set the temperature and belt speed to initial value(usually the manufacturer supply
when adjust)