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AN-1501 

   

 

Application Note 

 

www.power.com/igbt-driver                  

Page 4 

Manual Soldering 

Name 

Leaded 

Lead-Free 

Solder iron temperature 

320°C 

340°C (SAC305) 

Maximum solder time 

3-4s 

 
It is recommended to use lead-free solder EF2210, SAC305 alloy. However, other solder types may also be 

used. 

Mechanical Handling  

The correct handling of mechanical gate drivers is based on two fundamental principles: 

1)

 

No excessive mechanical force must be applied to transformers. 

2)

 

No excessive mechanical force causing bending (reflected to IPC-T-650) must be applied to PCBs. 

The  root causes of  possible driver failure  mentioned  above  may  appear  during mounting and later during 

operation. If the carrier PCB on which the driver core is placed is large, there is a risk of driver PCB bending 

referred  to the  carrier PCB. These phenomena can be seen  during vibrations tests where momentary 

displacement between driver core and carrier PCB can be observed.  Therefore  if  significant vibrations are 

foreseeable, it is necessary to mechanically stabilize the driver. 

Insertion of Gate Driver Cores into the Carrier PCB 

It is recommended that no large steady-state or temporary mechanical force be applied to the transformers or 

terminals of the gate core drivers. Applying excessive mechanical force to the transformer bends the PCB and 

considerably stresses the transformer solder joints, leading to potential pre-damage. This increases the 

probability of cracks at the transformer  solder points and other assembled SMD components, especially 

ceramic capacitors and resistors. 
The transformer may be held by hand during removal  or  insertion  from/into the packaging or assembly to 

carrier PCB, but the PCB should be free from bending.  
Fig.  1  illustrates  the correct  removal and assembly  of the driver core.  If mechanical force  applied to 

transformer causes PCB bending or excessive mechanical stress to the solder joints, the force must be shifted 

directly to the corresponding terminals of the driver PCB. 

 

 

 

 

 

        

 

Fig. 1   Not recommended (left) and recommended (right) ways of handling Power Integrations gate driver 

cores during assembly (body plan of a driver) 

Transformer 

Transformer 

Summary of Contents for SCALE-1

Page 1: ...eline for Return Material Analysis RMA The information given here applies to all customers distributors and suppliers receiving high power products from Power Integrations Content Scope 1 Content 1 Storage Conditions 2 Soldering Instructions for Driver Core Products 3 Reflow Soldering 3 Wave Soldering 3 Selective Soldering 3 Manual Soldering 4 Mechanical Handling 4 Insertion of Gate Driver Cores i...

Page 2: ...ed desiccant Humidity Indicator Card HIC sealed moisture barrier bag ESD protection Nitrogen 25 C 10 C 85 48 Table 1 Environmental conditions and lifetime during storage and transportation Legend 1 Low pollution atmosphere and packaging 2 Valid for single packed drivers 3 Valid for single packed trays and stored in a nitrogen atmosphere 4 Number of desiccant units to be calculated according to JED...

Page 3: ...ragging rate 2 8mm s3 Point soldering time 3 5s4 1 depending on the length of the wave soldering machine 2 depending on the thermal mass and components on the board when it reaches the solder pot 3 depending on the solder joint size The solder nozzle should be selected depending on the surface area of the solder joint 4 depending on the size of the solder joint Parameter Leaded Lead Free Flux 25 w...

Page 4: ...reseeable it is necessary to mechanically stabilize the driver Insertion of Gate Driver Cores into the Carrier PCB It is recommended that no large steady state or temporary mechanical force be applied to the transformers or terminals of the gate core drivers Applying excessive mechanical force to the transformer bends the PCB and considerably stresses the transformer solder joints leading to poten...

Page 5: ...m by 51 56mm The maximum permissible bending due to forces applied to the PCB would be 0 29mm and 0 26mm respectively Fig 2 Dimensions of a standard Power Integrations gate driver core In case of Plug and Play drivers which are screw fitted to a power module it is important to adjust the height of the distance bolts properly This will increase the driver s vibration withstand capability and avoid ...

Page 6: ...o be kept to a minimum Guideline for Return Material Analysis RMA The following requirements are necessary to ensure proper RMA process handling Acquire RMA number from the Power Integrations Customer Service Department before return For each RMA case a Driver Failure Description Form DFDF must be completed In the customs documents a goods value of 1 USD must be specified Returned product must be ...

Page 7: ...the accuracy or completeness of the statements technical information and recommendations contained herein No responsibility is accepted for the accuracy or sufficiency of any of the statements technical information recommendations or opinions communicated and any liability for any direct indirect or consequential loss or damage suffered by any person arising therefrom is expressly disclaimed Manuf...

Page 8: ...uilding No 2 Keji South 8th Road Nanshan District Shenzhen China 518057 Phone 86 755 8672 8725 Fax 86 755 8672 8690 Hotline 86 400 0755 669 Email chinasales power com UK Cambridge Westbrook Centre Block 5 2nd Floor Milton Road Cambridge CB4 1YG Phone 44 0 1223 446483 Email eurosales power com India Bangalore 1 14th Main Road Vasanthanagar Bangalore 560052 India Phone 91 80 4113 8020 Fax 91 80 4113...

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