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RM3000-f & RM2000-f Sensor Suite User Manual

– August 2012

Page 17 of 42

Note:

PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad to reduce

sensor tilt and misalignment. The above layout allows for rework: for minimal footprint, contact PNI.

Figure 3-15: Sen-Z-f (13101) Recommended Solder Pad, Paste, & Mask Layout

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Summary of Contents for RM2000-f

Page 1: ...User Manual RM3000 f RM2000 f Geomagnetic Sensor Suite ...

Page 2: ...24 4 4 SPI TIMING REQUIREMENTS 28 4 5 IDLE MODE 29 5 3D MAGIC OPERATION STANDARD MODE 30 5 1 CYCLE COUNT REGISTERS 30 5 2 SINGLE AXIS MEASUREMENT SAM OPERATION 32 5 2 1 SAM SPI Activity Sequence 32 5 2 2 SAM Command Byte 33 5 2 3 Making a Single Axis Measurement 33 5 3 MULTI AXIS MEASUREMENT MAM OPERATION 34 5 3 1 MAM SPI Activity Sequence 34 5 3 2 MAM Command Byte 34 5 3 3 MAM Axes Select Byte 35...

Page 3: ...LF Mechanical Drawing 18 Figure 3 17 3D MagIC MLF Tape Dimensions 18 Figure 3 18 Recommended Solder Reflow Profile 19 Figure 4 1 RM3000 f reference schematic Standard Mode 21 Figure 4 2 LR Oscillator Circuit Biasing Diagram 22 Figure 4 3 RM3000 f North East Down NED Sensor Layout 23 Figure 4 4 SPI Timing Diagram 28 Figure 5 1 SPI Activity Sequence Diagram for SAM Operation 32 Figure 5 2 SPI Activi...

Page 4: ...LIABILITY If any Product furnished hereunder fails to conform to the above warranty Customer s sole and exclusive remedy and PNI s sole and exclusive liability will be at PNI s option to repair replace or credit Customer s account with an amount equal to the price paid for any such Product which fails during the applicable warranty period provided that i Customer promptly notifies PNI in writing t...

Page 5: ...arallel to the sensor the 3D MagIC s internal clock is used to measure the circuit s oscillation frequency cycle counts and hence the magnetic field The 3D MagIC also contains an interface circuitry to communicate with a host microprocessor on an SPI bus The 3D MagIC can control and measure up to three PNI geomagnetic sensors with each sensor individually selected for measurement and individually ...

Page 6: ...ed performance characteristics assume the user implements the recommended bias resistors and external timing resistor for the high speed clock as indicated in Figure 4 1 and the 3D MagIC ASIC is operated in Standard Mode Other bias resistors external timing resistors and operating voltages may be used but performance may differ from the values listed 2 Field measurement range is defined as the mon...

Page 7: ...amage to the device These are stress ratings only Assuming operation with the 3D MagIC per the guidelines in this manual these maximum ratings will not be violated Table 3 3 Sen XY f and Sen Z f Characteristics1 Parameter Min Typical Max Units Inductance 1 500 600 H DC resistance 25C 15C 30 45 Resistance versus temperature 0 4 C Weight Sen XY f 0 06 0 002 gm oz Sen Z f 0 09 0 003 gm oz Operating T...

Page 8: ...se or other conditions beyond those indicated in the operational sections of the specifications is not implied Table 3 5 3D MagIC Recommended Operating Conditions Parameter Symbol Min Typ Max Units Analog Digital DC Supply Voltage AVDD DVDD 1 6 3 3 3 6 VDC Supply Voltage Difference DVDD AVDD During Operation VDD_OP 0 1 0 0 1 VDC Analog Unpowered VDD_OFF DVDD 0 1 DVDD DVDD 0 1 VDC Supply Voltage Ri...

Page 9: ... representative of performance as a function of the number of cycle counts which is a parameter directly controlled by the user The first two plots show performance for operation in both Standard Mode and the default Legacy Mode out to 10 000 cycle counts The maximum number of cycle counts in Legacy Mode is 4096 In Standard Mode the maximum cycle counts is 65 5k but there s rarely a reason to oper...

Page 10: ...des Resolution 1 Gain to the system s noise limit Figure 3 3 Single Axis Sample Rate vs Cycle Counts Standard Legacy Modes 0 1 1 10 100 1000 10000 10 100 1000 10000 Gain counts µT Cycle Counts Standard Mode Legacy Mode default config 1 10 100 1000 10000 10 100 1000 10000 Maximum Single Axis Sample Rate Hz Cycle Counts Standard Mode Legacy Mode default config ...

Page 11: ...on 1 Gain to the system s noise limit Figure 3 5 Single Axis Sample Rate vs Cycle Counts Standard Mode 0 10 20 30 40 50 60 0 25 50 75 100 125 150 175 200 225 250 Gain counts µT Cycle Counts 0 300 600 900 1200 1500 1800 2100 2400 2700 3000 0 25 50 75 100 125 150 175 200 225 250 Maximum Single Axis Sample Rate Hz Cycle Counts ...

Page 12: ...RM2000 f Sensor Suite User Manual August 2012 Page 12 of 42 Figure 3 6 Current Consumption vs Cycle Counts Standard Mode 0 50 100 150 200 250 300 0 25 50 75 100 125 150 175 200 225 250 Current Consumption 35 Hz Single Axis Sample Rate uA Cycle Counts ...

Page 13: ... of 42 3 5 Dimensions Packaging and Pad Mask Layout 3 5 1 Sen XY f Figure 3 7 Sen XY f Sensor Dimensions Dimensions in mm Full reel is 5000 pcs Smaller quantities on cut tape Tape reel meets ANSI EIA standard EIA 418 B Figure 3 8 Sen XY f Tape and Reel Dimensions ...

Page 14: ...PNI recommends a 5 mil stencil The solder paste area is much smaller than the pad to reduce sensor tilt and misalignment The above layout allows for rework for minimal footprint contact PNI Figure 3 9 Sen XY f Recommended Solder Pad Paste Mask Layout 3 5 1 Sen Z f 13070 Figure 3 10 Sen Z f 13070 Sensor Dimensions ...

Page 15: ...ler quantities on cut tape Tape reel meets ANSI EIA standard EIA 418 B Figure 3 11 Sen Z f 13070 Tape and Reel Dimensions Note PNI recommends a 5 mil stencil The solder paste area is much smaller than the pad to reduce sensor tilt and misalignment Figure 3 12 Sen Z f 13070 Recommended Solder Pad Paste Mask Layout ...

Page 16: ...te User Manual August 2012 Page 16 of 42 3 5 2 Sen Z f 13101 Figure 3 13 Sen Z f 13101 Sensor Dimensions Dimensions in mm Full reel is 1200 pcs Smaller quantities on cut tape Tape reel meets ANSI EIA standard EIA 418 B Figure 3 14 Sen Z f 13101 Tape and Reel Dimensions ...

Page 17: ...f 42 Note PNI recommends a 5 mil stencil The solder paste area is much smaller than the pad to reduce sensor tilt and misalignment The above layout allows for rework for minimal footprint contact PNI Figure 3 15 Sen Z f 13101 Recommended Solder Pad Paste Mask Layout ...

Page 18: ...Sensor Suite User Manual August 2012 Page 18 of 42 3 5 3 3D MagIC Figure 3 16 3D MagIC MLF Mechanical Drawing Dimensions mm Full reel is 5000 pcs Smaller quantities on cut tape Tape Reel meets ANSI EIA standard EIA 418 Figure 3 17 3D MagIC MLF Tape Dimensions ...

Page 19: ...and processing parameters for RM3000 f components After soldering PNI components to a board it is possible to wave solder the opposite side of the PCB IMPORTANT PNI sensors require the use of halide free solder pastes and processes for reflow and cleaning Please contact PNI if you would like recommendations Figure 3 18 Recommended Solder Reflow Profile PB ...

Page 20: ... Time TSmin to TSmax 60 180 seconds Solder Melt Temperature TL 218 C Ramp Up Rate TSmax to TL 3 C second maximum Peak Temperature TP 260 C Time from 25 C to Peak TP 6 minutes maximum Time above TL tL 60 120 seconds Soak Time within 5 C of TP tP 10 20 seconds Rampdown Rate 4 C second maximum Footnote 1 Meets IPC JEDEC J STD 020 profile recommendations Sen XY f and Sen Z f classified as moisture sen...

Page 21: ...sensor if desired Unused sensor connections should remain floating To implement either Geomagnetic Sensor Suite in Legacy Mode the Mode pin pin 12 should be connected to DVDD rather than tied to ground Note RM3000 f and RM2000 f Geomagnetic Sensor Suites typically are used in compassing applications where each channel represents a Cartesian coordinate axis x y or z For this reason the term axis ge...

Page 22: ...ame magnitude but opposite direction for the two bias polarities the external magnetic field is proportional to the difference in the time to complete the user defined number of cycle counts The difference in the number of clock oscillations between the forward and reverse bias directions is output from the 3D MagIC and this number is directly proportional to the strength of the local magnetic fie...

Page 23: ...n Z f s ZDRVN and ZDRVP pads should be as shown above except on the bottom of the board As the pads on the Sen Z f have switched positions the connections to the Sen Z f sensor will be reversed 4 2 2 Local Magnetic Field Considerations Because the sensors measure magnetic field it is important to consider what items in the vicinity of the sensors can affect the sensor readings Specifically The sen...

Page 24: ...he board remains constant while doing this If an RM3000 f Evaluation Board is not available gradually bring the component in question closer to one of the geomagnetic sensors and observe when the sensor reading starts to change Note that the affect of a local magnetic distortion drops off as 1 distance 3 4 2 3 Other Layout Considerations Other design considerations include To minimize the effect o...

Page 25: ...sor drive output 11 YINP Y sensor measurement input 12 MODE Mode Select tie to DVSS for Standard DVDD for Legacy 13 YINN Y sensor measurement input 14 YDRVN Y sensor drive output 15 XDRVP X sensor drive output 16 XINP X sensor measurement input 17 XINN X sensor measurement input 18 XDRVN X sensor drive output 19 DVSS Ground pin for digital section of ASIC NC Do not connect 20 NC Do not connect 21 ...

Page 26: ...e SPI bus The SSN pin must be LOW prior to data transfer in either direction and must stay LOW during the entire transfer The SSN pin must transition from HIGH to LOW prior to initiating a multi axis measurement MAM command and prior to reading or writing to the Cycle Count Register or Clock Divide Register It must stay LOW for the remainder of the operation After communication between the 3D MagI...

Page 27: ...sensor measurement in progress CLEAR has no effect on the SPI register state Note The CLEAR pin is similar to the RESET pin on PNI s legacy ASIC However in Standard Mode the 3D MagIC automatically resets the DRDY line so it is not necessary to use the CLEAR pin when operating in Standard Mode AVDD and DVDD Supply Voltages AVDD and DVDD should be tied to the analog and digital supply voltages respe...

Page 28: ... a SPI port whether a dedicated hardware peripheral port or a software implemented port using general purpose I O also known as Bit Banging the timing parameters defined in Figure 4 4 and specified in Table 4 2 must be met to ensure reliable communication Note that Standard Mode and Legacy Mode timing requirements are identical with the exception of Legacy Mode utilizing the CLEAR line The SPI clo...

Page 29: ...ive edge 50 ns tSHDZ Time from SSN to data tri state time 100 ns 4 5 Idle Mode The 3D MagIC incorporates an Idle Mode to reduce power consumption in which the circuit automatically idles when it is not exchanging data or taking a measurement The 3D MagIC starts in the Idle Mode at power up and remains in Idle Mode until a measurement is needed Note The 3D MagIC starts in Idle Mode when powered on ...

Page 30: ...e axis measurement SAM and Multi axis measurement MAM The SAM Command Byte initiates a measurement for one sensor and sets up the 3D MagIC to write the measured values out on the MISO line The MAM Command Byte initiates a sensor measurement for up to 3 sensors and a later Command Byte sets up the 3D MagIC to write the measured values out on the MISO line for up to 3 sensors For two or three axis s...

Page 31: ...h register will be written to or read from Each sensor is represented by two registers with addresses defined as follows Table 5 1 Cycle Count Register Commands Register Description Read Command Byte Write Command Byte X Axis Cycle Count Value MSB C3H 83H X Axis Cycle Count Value LSB C4H 84H Y Axis Cycle Count Value MSB C5H 85H Y Axis Cycle Count Value LSB C6H 86H Z Axis Cycle Count Value MSB C7H ...

Page 32: ...the Z axis pointer automatically increments Set SSN to HIGH 5 2 Single Axis Measurement SAM Operation The SAM Command Byte initiates a sensor measurement on a single sensor and sets up the 3D MagIC to output the measured values on the MISO line Generally SAM operation is not as efficient as MAM operation except when only one sensor in total is to be measured 5 2 1 SAM SPI Activity Sequence The SPI...

Page 33: ...SAM Command Byte is clocked into the 3D MagIC on the MOSI pin Simultaneously the 3D MagIC will present a fixed 9AH on the MISO pin Once the 8 bits have clocked in the 3D MagIC will execute the command i e take a measurement The SSN input may be returned HIGH at this point to free up host communication with another device if desired This will not affect the measurement process A measurement is take...

Page 34: ...asured Each axis is comprised of 3 bytes of data so for a 3 axis measurement 9 total bytes would be clocked out to receive all the data The Command Byte and Axes Select Byte are discussed below Figure 5 2 SPI Activity Sequence Diagram for MAM Operation 5 3 2 MAM Command Byte The MAM Command Byte either initiates a sensor measurement or initiates placing the measurement results on the MISO line for...

Page 35: ...nt format range 8388608 to 8388607 Start with SSN set HIGH then set SSN to LOW Initiate a sensor measurement by sending 82H MAM Command Byte to write to the Mode Register followed by 01H Mode Register Word to initiate measurement on the MOSI pin The 3D MagIC will now take the prescribed measurements Return SSN to HIGH This will not affect the measurement process but will free up the host to commun...

Page 36: ...ment values Data is clocked out on the MISO pin Each sensor reading consists of 3 bytes of data clocked out MSB first X axis data is presented first then y axis data then z axis data The first nine 9 bytes represent a complete 3 axis measurement Return SSN to HIGH to free up the host to communicate with other devices and to ensure the next Command Byte sent to the 3D MagIC is interpreted properly ...

Page 37: ... For Enhanced Legacy Operation the user first will write to the Clock Divide Register and after this follow the same process as for Legacy Operation Please review both Sections 6 1 and 6 2 as Section 6 1 still applies and Section 6 2 covers the additional steps required for Enhanced Legacy Operation 6 1 Legacy Operation In Legacy Mode a sensor measurement is initiated with the Legacy Command Byte ...

Page 38: ...ll be clocked out for a Legacy measurement The Command Byte is discussed below Figure 6 1 SPI Activity Sequence Diagram for Legacy Operation 6 1 2 Legacy Command Byte The command byte to initiate a sensor measurement is defined as follows Bit 7 6 5 4 3 2 1 0 Value 0 PS2 PS1 PS0 0 0 AS1 AS0 PS0 PS2 Period Select Selects the number of sensor circuit oscillation cycles cycle counts to be counted whil...

Page 39: ...r measurement are given below In Legacy Mode the 3D MagIC returns the result of a complete forward reverse measurement of the sensor in a 16 bit 2 s complement format range 32768 to 32767 Note this is different from Standard Mode where a 24 bit value is returned SSN pin is set LOW This enables communication with the master device CLEAR pin is set HIGH then LOW This is not required but is optional ...

Page 40: ...urement operation and finer granularity in establishing the number of cycle counts The 3D MagIC incorporates a Clock Divide Register that effectively divides the 3D MagIC s high speed internal clock by some integer value Clock Divide Value In Legacy Mode the default is 16 as this results in performance matching that of the 11096 ASIC at similar Period Select values But for the most efficient opera...

Page 41: ...0 R W Read Write When HIGH signifies a Read operation from the Clock Divide Register When LOW signifies a Write operation to the Clock Divide Register 6 2 2 Clock Divide Register The Clock Divide Register is defined as follows Bit 7 6 5 4 3 2 1 0 Value 0 0 0 0 0 CD2 CD1 CD0 Table 6 3 Clock Divide Bits Clock Divide Value CD2 CD1 CD0 1 Standard Mode default 0 0 0 2 0 0 1 4 0 1 0 8 0 1 1 16 Legacy Mo...

Page 42: ...lly reduced and the Period Select value in the Legacy Command Byte should be altered Generally speaking the best performance will be obtained with the Clock Divide Value set to 1 Table 6 4 Enhanced Legacy Mode with CD 1 Default Legacy Enhanced Legacy with CD 1 Period Select Cycle Counts Equivalent1 Period Select Cycle Counts Power Consumption Gain 0 32 0 32 same 16x greater 1 64 0 32 40 reduction ...

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