4
VSX-523-K
1
2
3
4
A
B
C
D
E
F
1
2
3
4
1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING
1.2 NOTES ON REPLACING PARTS
1.3 SERVICE NOTICE
• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
• Compared with conventional eutectic solders, lead-free solders have higher melting points, by approximately 40 ºC.
Therefore, for lead-free soldering, the tip temperature of a soldering iron must be set to around 373 ºC in general, although
the temperature depends on the heat capacity of the PC board on which reworking is required and the weight of the tip of
the soldering iron.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
Compared with eutectic solders, lead-free solders have higher bond strengths but slower wetting times and higher melting
temperatures (hard to melt/easy to harden).
The following lead-free solders are available as service parts:
• Parts numbers of lead-free solder:
GYP1006 1.0 in dia.
GYP1007 0.6 in dia.
GYP1008 0.3 in dia.
The part listed below is difficult to replace as a discrete component part.
W
hen the part listed in the table is defective, replace whole Assy.
Assy Name
D-MAI
N
Assy
5
V
S
W
Power Supply IC
——————
IC with heat-pad
IC2007
I
N
TERFACE IC
——————
IC with heat-pad
IC2012
D-MAI
N
1.2
V
Power Supply IC
——————
IC with heat-pad
IC2013
D-MAI
N
1.
8
V
Power Supply IC
——————
IC with heat-pad
IC2015
DSP IC
——————
IC with heat-pad
IC2016
Low Dropout Power Supply IC
——————
IC with heat-pad
IC2017
APPLE AUTHE
N
TICATIO
N
IC
——————
IC with heat-pad
IC2020
USB 5
V
Power Supply IC
——————
IC with heat-pad
IC2021
Parts that is Difficult to Replace
Ref No.
Function
Part No.
Remarks
• Discharging
For more detail, please refer to "7. DISASSEMBLY - 1. Discharging".
