Philips Semiconductors
Product specification
Logic level TOPFET
PIP3119-P
MECHANICAL DATA
Fig.2. SOT78B (TO220AB) package
1
, pin 2 connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT78B
D
D1
q
L
1
2
3
L1
b1
e
e
b
(1)
0
5
10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads
SOT78B
DIMENSIONS (mm are the original dimensions)
A
E
A1
c
Notes
1. The positional accuracy of the terminals is controlled within zone L1 max.
2. Mounting base configuration is not defined within the dimensions E and D
Q
L2
UNIT
A1
b1
D1
e
∅
p
mm
2.54
q
Q
A
b
(1)
D
c
L2
max.
3.0
3.8
3.6
4.3
4.1
15.0
13.5
3.30
2.79
3.0
2.7
2.6
2.2
w
0.4
0.7
0.4
15.8
15.2
0.85
0.60
1.3
1.0
4.5
4.1
1.39
1.27
6.4
5.9
10.3
9.7
L1
p1
E
L
01-02-22
mounting
base
(2)
w
M
∅
p
p1
1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g
May 2001
5
Rev 1.000
