Philips HTS3260/12, Service Manual

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Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
one must treat all sets from 1 Jan 2005 onwards, according
next rules:
Important note: In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solder-
alloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
•
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
not easy to store and to handle.
•
Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400 @ C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
•
Adjust your solder tool so that a temperature around
360
@
C – 380
@
C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400
@
C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un-
used equipment, or reduce heat.
•
Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
•
Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
•
Special information for BGA-ICs:
–
Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature profile,
in case of doubt)
–
Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
•
On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.