Philips DVDR3320V Series, Service Manual, Page: 5 / 196

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INFORMATION ABOUT LEAD-FREE SOLDERING
Philips CE is producing lead-free sets from 1.1.2005 onwards.
INDENTIFICATION:
Regardless of special logo (not always indicated)
one must treat all sets from 1 Jan 2005 onwards, according next rules:
Example S/N:
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8
is the week number, so in this case 1991 wk 18
So from 0501 onwards = from 1 Jan 2005 onwards
Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys
(leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required,
please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able
* To reach at least a solder-temperature of 400°C,
* To stabilize the adjusted temperature at the solder-tip
* To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around 360°C – 380°C is reached and stabilized at the solder joint.
Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips
will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce
heat.
• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to
avoid mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy
and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be pur-
chased at external companies.
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the
lead-free temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘dry-packaging’ (sealed pack including a silica gel pack) to protect the
IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still
has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all
needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.
• On our website www.atyourservice.ce.Philips.com you find more information to:
* BGA-de-/soldering (+ baking instructions)
* Heating-profiles of BGAs and other ICs used in Philips-sets
You will find this and more technical information within the “magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.