2000 Oct 16
10
Philips Semiconductors
Product specification
GSM/DCS/PCS power amplifier
CGY2014TT
PACKAGE OUTLINE
UNIT
A1
A2
A3
bp
c
D
(1)
E
(2)
Z
(1)
Dh
e
L
Lp
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
Eh
HE
3.1
2.9
4.5
4.3
0.65
6.6
6.2
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT527-1
99-11-12
00-07-12
w
M
bp
D
Dh
Eh
Z
heathsink side
e
0.25
1
10
20
11
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
SOT527-1
A
max.
1.10
pin 1 index
