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Manual 21354 Rev E 
ECN 50523 

 

 

Component Name 

Hazardous Substances 

Lead (Pb)  Mercury (Hg) 

Cadmium (Cd) 

Chromium VI 
Compounds 
(Cr(VI)) 

Polybrominated 
Biphenyls (PBB) 

Polybrominated 
Diphenyl Ethers 
(PBDE) 

Housing 

PCB Board 

Electrical Connectors 

Piezoelectric Crystals 

Epoxy 

Teflon 

Electronics 

Thick Film Substrate 

Wires 

Cables 

Plastic 

Solder 

Copper Alloy/Brass 

This table is prepared in accordance with the provisions of SJ/T 11364. 
O: Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit 
requirement of GB/T 26572. 

X: Indicates that said hazardous substance contained in at least one of the homogeneous materials for this part is above the limit 
requirement of GB/T 26572. 
Lead is present due to allowed exemption in Annex III or Annex IV of the European RoHS Directive 2011/65/EU. 

Summary of Contents for 3501A2060KG

Page 1: ...SHOCK Accelerometer Installation and Operating Manual For assistance with the operation of this product contact the PCB Piezotronics Inc Toll free 716 684 0001 24 hour SensorLine 716 684 0001 Fax 716...

Page 2: ...alized tests including sensitivity at elevated or cryogenic temperatures phase response extended high or low frequency response extended range leak testing hydrostatic pressure testing and others For...

Page 3: ...tion on particular operating steps The following symbols may be found on the equipment described in this manual This symbol on the unit indicates that high voltage may be present Use standard safety p...

Page 4: ...China RoHS 2 Disclosure Table Pb Hg Cd Cr VI PBB PBDE O O O O O O PCB X O O O O O O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O X O O O O O O O O O X O O O O O O O O O O O X O O O O...

Page 5: ...O Wires O O O O O O Cables X O O O O O Plastic O O O O O O Solder X O O O O O Copper Alloy Brass X O O O O O This table is prepared in accordance with the provisions of SJ T 11364 O Indicates that sai...

Page 6: ...icro electromechanical systems MEMS technology in which all structural and electronic components are manufactured in silicon using electronic microfabrication technologies MEMS devices are preferred i...

Page 7: ...ck the mounting torque after each measurement It s also recommended that a thread locking adhesive be applied to any threads if applicable Ceramic LCC leadless chip carrier packages available in this...

Page 8: ...ipment for repair it is recommended that the user confer with a factory application engineer or inter national representative to first troubleshoot the problem 11 0 Return Procedure To expedite the re...

Page 9: ...x 0 236 in x 0 138 in 2 16 mm x 6 00 mm x 3 50 mm Weight 0 005 oz 0 15 gm 4 Electrical Connector Solder Tabs Solder Tabs Mounting Surface Mount Surface Mount All specifications are at room temperature...

Page 10: ......

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