Parker EME
Introduction
192-120102 N16 December 2010
9
2.4
Packaging, transport, storage
Packaging material and transport
Caution!
The packaging material is inflammable, if it is disposed of improperly by burning,
lethal fumes may develop.
The packaging material must be kept and reused in the case of a return shipment.
Improper or faulty packaging may lead to transport damages.
Make sure to transport the drive always in a safe manner and with the aid of
suitable lifting equipment (
Weight
(see on page 36)). Do never use the electric
connections for lifting. Before the transport, a clean, level surface should be
prepared to place the device on. The electric connections may not be damaged
when placing the device.
First device checkup
Check the device for signs of transport damages.
Please verify, if the indications on the
Type identification plate
(see on page 8)
correspond to your requirements.
Check if the consignment is complete.
Disposal
This product contains materials that fall under the special disposal regulation from
1996, which corresponds to the EC directory 91/689/EEC for dangerous disposal
material. We recommend to dispose of the respective materials in accordance with
the respectively valid environmental laws. The following table states the materials
suitable for recycling and the materials which have to be disposed of separately.
Material Option
suitable for
recycling
Disposal
Metal
yes
no
Plastic materials
yes
no
Circuit boards
no
yes
Please dispose of the circuit boards according to one of the following methods:
Burning at high temperatures (at least 1200°C) in an incineration plant licensed in
accordance with part A or B of the environmental protection act.
Disposal via a technical waste dump which is allowed to take on electrolytic
aluminum condensers. Do under no circumstances dump the circuit boards at a
place near a normal waste dump.
Storage
If you do not wish to mount and install the device immediately, make sure to store it
in a dry and clean
environment
(see on page 40). Make sure that the device is not
stored near strong heat sources and that no metal chippings can get into the
device.
