2 Warning
2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
4
VDR-D310EG / VDR-D310E / VDR-D310EB / VDR-D310EP / VDR-D310EF
Summary of Contents for VDR-D310E
Page 11: ...4 Specifications 11 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 13: ...13 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 14: ...14 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 20: ...8 2 P C B Layout Fig F1 20 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 22: ...Fig D1 Fig D2 Fig D3 Fig D4 22 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 23: ...Fig D5 Fig D6 Fig D7 Fig D8 23 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 24: ...Fig D9 Fig D10 Fig D11 24 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 25: ...Fig D12 Fig D13 Fig D14 Fig D15 25 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 26: ...Fig D16 Fig D17 Fig D18 Fig D19 26 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 27: ...Fig D20 Fig D21 27 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 36: ...36 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 46: ...VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF 46 ...
Page 52: ...52 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 53: ...13 1 2 LCD SECTION 53 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 54: ...13 1 3 CAMERA LENS SECTION 54 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
Page 55: ...13 1 4 EVF SECTION 55 VDR D310EG VDR D310E VDR D310EB VDR D310EP VDR D310EF ...
