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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-37PA30E / TH-42PA30E
Summary of Contents for TH-42PA30E
Page 8: ...Remove the Rear Cover Remove the AV Connector Cover 8 ...
Page 9: ...Service position 9 ...
Page 22: ...7 3 Lead of wiring 3 22 ...
Page 23: ...7 4 Lead of wiring 4 23 ...
Page 29: ...9 3 Option Description 29 ...
Page 30: ...30 ...
Page 38: ...12 Alignment 12 1 Pedestal setting 12 2 PAL panel white balance 38 ...
Page 39: ...12 3 PC panel white balance 39 ...
Page 40: ...12 4 Sub brightness setting 40 ...
Page 49: ...17 Packing Exploded Views 49 ...
Page 50: ...50 ...
Page 51: ...18 Mechanical Replacement Parts List 51 ...
Page 55: ...19 2 Electrical Replacement Part List 55 ...
Page 124: ...21 Cover for printing with A4 124 ...
Page 179: ...15 Block and Schematic Diagrams 15 1 Schematic Diagram Notes 69 ...
Page 180: ...15 Block and Schematic Diagrams 15 1 Schematic Diagram Notes 69 ...
Page 303: ...1 Applicable signals 5 TH 37PA30E TH 42PA30E ...
Page 313: ...7 Location of Lead Wiring 7 1 Lead of Wiring 1 15 TH 37PA30E TH 42PA30E ...
Page 314: ...7 2 Lead of wiring 2 16 TH 37PA30E TH 42PA30E ...
Page 315: ...7 3 Lead of wiring 3 17 TH 37PA30E TH 42PA30E ...
Page 316: ...7 4 Lead of wiring 4 7 5 Lead of wiring 5 18 TH 37PA30E TH 42PA30E ...
Page 322: ...24 TH 37PA30E TH 42PA30E ...
Page 323: ...9 3 Option Description 25 TH 37PA30E TH 42PA30E ...
Page 324: ...26 TH 37PA30E TH 42PA30E ...
Page 327: ...10 4 IIC mode structure following items value is sample data 29 TH 37PA30E TH 42PA30E ...
Page 331: ...12 Alignment 12 1 Pedestal setting 33 TH 37PA30E TH 42PA30E ...
Page 332: ...12 2 PAL panel white balance 34 TH 37PA30E TH 42PA30E ...
Page 333: ...12 3 PC panel white balance 35 TH 37PA30E TH 42PA30E ...
Page 334: ...12 4 Sub brightness setting 36 TH 37PA30E TH 42PA30E ...