User’s Manual
43
Revision 1.3, 2013-08-14
Hardware Description
PAN1322-SPP
ENW89841A3KF
Assembly Guidelines
10.6.2.2 Alternative 2: Printing Solder
To print solder on the module a fixture must be used. The purpose of the fixture is to get a flat surface and fix the
stencil and module for printing. An example of how this fixture can be designed is shown in
.
Solder _P rint ing . v s d
Vacuum hol es
Solder paste stencil
C avity of the module
T ooling pins
B ottom
Fixture
Figure 19
Solder Printing
1. Assemble the fixture to the bottom
2. Place the module in the cavity with the LGA pads upwards
3. Place the solder paste stencil on the fixture and make sure it fits to the tooling pins and the module
4. Apply vacuum to fix the solder paste stencil
5. Apply solder paste on the stencil and print by using a blade
6. Turn everything (bottom, fixture and stencil) upside down.
7. Separate carefully the bottom from the fixture
8. Pick the module by a nozzle and place in the right position on the board
9. Reflow the solder.
10.7
Inspection
Automatic inspection of the solder paste printing before assembly is highly recommended to ensure high yield and
good long term reliability.
10.8
Component Salvage
If it is intended to send a defect PAN1322 module back to the supplier for failure analysis, please note that during
the removal of this component no further defects must be introduced to the device, because this may hinder the
failure analysis at the supplier. This includes ESD precautions, not to apply high mechanical force for component
removal, and to prevent excess moisture content in the package during salvage (risk of pop corning failures).
Therefore if the maximum storage time out of the dry pack (see label on packing material) is exceeded after board
assembly, the PCB has to be dried 24h at 125°C before soldering off the defect component, because otherwise
too much moisture may have been accumulated.
