8
3 Service Navigation
3.1.
Introduction
This service manual contains technical information, which will allow service personnel's to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, the information will be followed by service manual to be controlled with original service manual.
3.2.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
°
C (86
°
F) more than that of the
normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
• (Definition: The letter of
is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees
C (662±86
°
F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
3.3.
Important Notice 1:(Other than U.S.A. and Canadian Market)
1. The service manual does not contain the following information, because of the impossibility of servicing at component level
without concerned equipment/facilites.
a. Schematic diagram, Block Diagram and PCB layout of MAIN PCB.
b. Parts list for individual parts for MAIN PCB.
When a part replacement is required for repairing MAIN PCB , replace as an assembled parts. (Main PCB)
2. The following category is/are recycle module part. please send it/them to Central Repair Center.
• MAIN PCB (VEP56051A) : Excluding replacement of Lithium Battery
The letter of
is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Summary of Contents for Lumix DMC-FZ18E
Page 12: ...12 4 Specifications ...
Page 13: ...13 ...
Page 14: ...14 ...
Page 15: ...15 5 Location of Controls and Components ...
Page 16: ...16 ...
Page 23: ...23 8 Disassembly and Assembly Instructions 8 1 Disassembly Flow Chart ...
Page 25: ...25 8 3 1 Removal of the Rear Case Unit Fig D1 Fig D2 ...
Page 30: ...30 8 4 3 Removal of the 2nd Lens Frame Unit 8 4 4 Removal of the Master Flange Unit ...
Page 31: ...31 8 4 5 Removal of the Cam Frame 8 4 6 Removal of the Focus Motor Unit ...
Page 32: ...32 8 4 7 6 Removal of the 4th Lens Frame Unit 8 4 8 Removal of the 3rd Lens Frame Unit ...