PREFACE
2. Warning
2.1
.Prevention
of Electrostatic
Dischargearge
(ESD) to Electrostatically Sensitive (ES)
Devic
tive
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Elec-trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component
damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)”
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the
brush-ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
5
Summary of Contents for LH-32RM1MX
Page 7: ...PREFACE 3 Specifications 7 ...
Page 8: ...8 ...
Page 10: ...SECTION 1 SERVICE INFORMATION 1 Name of each part 1 1 Display body INF 2 ...
Page 11: ...SECTION 1 SERVICE INFORMATION 1 2 Connecting terminals INF 3 ...
Page 12: ...SECTION 1 SERVICE INFORMATION 1 3 Remote controls INF 4 ...
Page 14: ...SECTION 1 SERVICE INFORMATION 3 Service Mode 3 1 Watching display INF 6 ...
Page 15: ...SECTION 1 SERVICE INFORMATION INF 7 ...
Page 16: ...SECTION 1 SERVICE INFORMATION INF 8 ...
Page 17: ...SECTION 1 SERVICE INFORMATION 3 2 Using Media Player INF 9 ...
Page 18: ...SECTION 1 SERVICE INFORMATION INF 10 ...
Page 29: ...SECTION 2 DISASSEMBLY PROCEDURES DIS 7 ...
Page 30: ...SECTION 2 DISASSEMBLY PROCEDURES DIS 8 ...
Page 44: ...SECTION 3 ADJUSTMENTS 5 2 RS232 CODE ADJ 14 ...
Page 46: ...SECTION 4 DIAGRAMS 1 Block Diagrams 1 1 A module DIA 2 ...
Page 47: ...SECTION 4 DIAGRAMS 1 2 P module DIA 3 ...
Page 49: ...SECTION 5 PARTS LIST 1 Exploded views 1 1 Mechanical and electrical parts SPL 2 ...
Page 50: ...SECTION 5 PARTS LIST 2 IGP List SPL 3 ...
Page 51: ......