Be certain each pin is located over the correct pad on the PCB.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins while feeding enough solder to the
tip so that it flows under the pins as they are heated.
11.3. Modification Procedure of Bridge
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of the
pin to draw the solder from between the adjacent pads.
12. TERMINAL GUIDE OF ICs, TRANSISTORS AND
DIODES
23
Summary of Contents for KX-TSC10EXB
Page 3: ...1 BATTERY 3 ...
Page 4: ...2 LOCATION OF CONTROLS 4 ...
Page 5: ...3 DISPLAY 5 ...
Page 6: ...4 SETTINGS 4 1 Connecting the Handset Telephone Line Cord 6 ...
Page 8: ...4 3 How to Release the Establishment of Dial Lock 8 ...
Page 10: ...4 4 Call Restricstion 10 ...
Page 11: ...5 OPERATIONS 5 1 Making Calls 11 ...
Page 12: ...5 2 Answering Calls 12 ...
Page 15: ...7 2 Tone Dialing Problems handset 7 3 No Ringing Sound When Ring Signal is Input 15 ...
Page 19: ...19 ...
Page 20: ...10 2 CPU DATA IC801 10 3 RINGER IC IC2 20 ...
Page 21: ...10 4 EEPROM IC802 1 SCK 21 ...
Page 24: ...13 CABINET AND ELECTRICAL PARTS 24 ...
Page 25: ...14 ACCESSORIES AND PACKING MATERIALS 25 ...
Page 26: ...26 ...
Page 39: ...LCD1 KX TSC10EXB C W CIRCUIT BOARD CPU Flow Sloder Side View ...