- Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
13.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
13.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
Summary of Contents for KX-TMC40JX-W
Page 3: ......
Page 7: ...4 2 Time and Date ...
Page 8: ......
Page 9: ...4 3 LCD Contrast ...
Page 10: ...4 4 Making Calls ...
Page 11: ......
Page 12: ...4 5 Answering Calls ...
Page 13: ...4 6 Caller ID Service ...
Page 14: ...4 7 Usin the Caller List ...
Page 15: ...4 8 Viewing the Caller List ...
Page 16: ...4 9 Calling Back from the Caller List ...
Page 18: ...4 12 FLASH Button ...
Page 40: ...10 CPU DATA 10 1 IC201 ...
Page 41: ...11 FLASH MEMORY 11 1 IC300 IC301 ...
Page 42: ...12 MODULE BLOCK DIAGRAM 12 1 LCD MODULE BLOCK ...
Page 45: ...14 TERMINAL GUIDE OF ICs TRANSISTORS AND DIODES 15 CABINET AND ELECTRICAL PARTS ...
Page 46: ...16 ACCESSORIES AND PACKING MATERIALS ...
Page 62: ...CN801 MIC 2 1 24 23 PQUP11143ZA KX TMC40JXW OPERATION BOARD COMPONENT VIEW ...