Panasonic KX-TES824LA, Service Manual

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15.1. PREPARATION
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PbF (: Pb free) Solder
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Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
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Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free)
(P.5).
15.2. REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with a
cutter.
2. Make a few cuts into the joint (between the IC and its pins)
first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
15.3. INSTALLATION PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on the
PCB.
Be certain each pin is located over the
correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the
soldering iron along the tips of the pins while feeding
enough solder to the tip so that it flows under the pins as
they are heated.
15.4. REMOVING SOLDER FROM
BETWEEN PINS
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of
the pin to draw the solder from between the adjacent pads.
15 HOW TO REPLACE A FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),
a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
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KX-TES824LA / KX-TEM824LA /