it is converted to10.7 MHz and 455 KHz Intermediate by RF IC. The demodulated audio signal is
output from RF IC
(DET OUT) and passed through "Expander" process to reduce noise, then voice signal is led to
LINE AMP. The signal is
passed through TELEPHONE INTERFACE and Tel-line.
RX data (from Handset):
The data signal from handset (ex: Talk, ACK, COM) is also included in 49 MHz band same as the
voice data. After second if
filter, the data signal is made square shape by data limiting AMP of the RF IC. RX data is output
to CPU (RX Data).
16.6.3. RF signal operation/control and PLL operation (RF UNIT)
Base unit radio frequency signal received by antenna passes through duplexer (DPX1).
RF signal is amplified by RF AMP. RF signal received from RF IC is mixed with RX local
frequency at Mixer to generate
10.7 MHz wide band IF. The reference frequency is generated by X1 10.245 MHz crystal. VC1 is
the reference frequency
for adjustment. The 10.7 MHz is mixed with reference and 455KHz narrow band IF is generated.
The demodulation audio signal
is adjusted to the maximum at T1. RF IC is controlled by CPU (RF_STB, DATA, CLK). The RX
local frequency is generated
by RXVCO.
16.7. Signal Route
Each signal route is as follows.
40
Summary of Contents for KX-TC1206TWB
Page 3: ...1 2 Battery information 2 BATTERY REPLACEMENT 3 ...
Page 4: ...3 LOCATION OF CONTROLS 3 1 Base Unit 4 ...
Page 5: ...3 2 Handset 5 ...
Page 6: ...4 CONNECTION 6 ...
Page 9: ...5 OPERATIONS 5 1 Making Calls 5 2 Answering Calls 9 ...
Page 10: ...5 3 Storing Phone Numbers in Memory 5 4 Storing a Phone Number in the DIRECT Button 10 ...
Page 11: ...5 5 Dialing a Stored Number 5 6 Dialing the Stored Number in the DIRECT Button 11 ...
Page 12: ...5 7 Flash Button 6 DISASSEMBLY INSTRUCTIONS 12 ...
Page 28: ...28 ...
Page 30: ... The channel is changed if the noise interferes with the conversation 13 2 Ringing 30 ...
Page 31: ...13 3 Changing the Channel 31 ...
Page 43: ...Fig 6 18 CPU DATA Base Unit 18 1 IC2 43 ...
Page 44: ...19 CPU DATA Handset 19 1 IC2 44 ...
Page 45: ...20 HOW TO REPLACE FLAT PACKAGE IC 20 1 Preparation SOLDER 45 ...
Page 48: ...22 CABINET AND ELECTRICAL PARTS LOCATION HANDET 48 ...
Page 49: ...23 ACCESSORIES AND PACKING MATERIALS 49 ...
Page 64: ...H M KXTC1206TWB KXTC1206TWS KXTC1206TWF KXTC1206TWP 64 ...
Page 67: ...IC5 ...
Page 69: ...IC2 150Ω AF Volt Meter H Oscilloscope G Noise Squelch A Battery Low 47µF AF Generator ...
Page 71: ...IC2 G Noise Squelch A Battery Low VDD CPU 40 CHG DET CPU 37 TX DATA CPU 36 TX DATA DV1 ...