4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-V500EB
Page 9: ...9 3 5 Formatting ...
Page 10: ...10 4 Specifications ...
Page 11: ...11 ...
Page 24: ...24 Fig D6 Fig D7 ...
Page 25: ...25 8 3 4 Removal of the Lens Frame Unit Fig D8 8 3 5 Removal of the Camera Lens Unit Fig D9 ...
Page 26: ...26 8 3 6 Removal of the Main P C B and SD Holder P C B Fig D10 Fig D11 ...
Page 27: ...27 Fig D12 Fig D13 8 3 7 Removal of the ESD P C B HC V500M only Fig D14 ...
Page 28: ...28 8 3 8 Removal of the LCD Case T Unit and LCD Unit Fig D15 Fig D16 ...
Page 40: ...Model No HC V500 V500M Schematic Diagram Note ...
Page 41: ...Model No HC V500 V500M Parts List Note ...
Page 42: ...Model No HC V500 V500M Main Connection Main P C B ...
Page 43: ...Model No HC V500 V500M Video Main P C B ...
Page 44: ...Model No HC V500 V500M Lens Drive Main P C B ...
Page 45: ...Model No HC V500 V500M AVIO Main P C B ...
Page 46: ...Model No HC V500 V500M HDMI Main P C B ...
Page 47: ...Model No HC V500 V500M Charge RTC Main P C B ...
Page 48: ...Model No HC V500 V500M MIC Main P C B ...
Page 49: ...Model No HC V500 V500M Photo Light Main P C B ...
Page 50: ...Model No HC V500 V500M Power Main P C B ...
Page 51: ...Model No HC V500 V500M MOS Connection Main P C B ...
Page 52: ...Model No HC V500 V500M SD Holder SD Holder P C B ...
Page 53: ...Model No HC V500 V500M Main P C B Component Side ...
Page 54: ...Model No HC V500 V500M Main P C B Foil Side ...
Page 55: ...Model No HC V500 V500M SD Holder P C B Component Side ...
Page 56: ...Model No HC V500 V500M SD Holder P C B Foil Side ...
Page 66: ...Model No HC V500 V500M Frame and Casing Section ...
Page 67: ...Model No HC V500 V500M Packing Parts and Accessories Section ...