4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-V380EB
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Page 24: ...24 8 2 PCB Location ...
Page 27: ...27 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Page 31: ...31 Fig D12 Fig D13 ...
Page 33: ...33 Fig D17 Fig D18 ...
Page 34: ...34 8 3 10 Removal of the LCD Hinge Unit Fig D19 Fig D20 ...
Page 35: ...35 8 3 11 Removal of the Monitor P C B LCD Fig D21 Fig D22 ...
Page 38: ...38 8 3 14 Removal of the MOS Unit IR Cut Glass Fig D27 Fig D28 ...
Page 39: ...39 Fig D29 8 3 15 Removal of the 2nd Stepping Motor Fig D30 ...
Page 40: ...40 Fig D31 8 3 16 Removal of the 3rd Stepping Motor Fig D32 ...
Page 41: ...41 Fig D33 8 3 17 Removal of the Focus Stepping Motor Fig D34 ...
Page 42: ...42 Fig D35 ...
Page 45: ...45 Level Shot Adjutment Chart ...
Page 47: ...47 9 1 2 Adjustment Items Adjustment item as follows ...
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