PAN1322-SPP
ENW89841A3KF
User’s Manual
42
Revision 1.3, 2013-08-14
Hardware Description
Assembly Guidelines
At the reflow process each solder joint has to be exposed to temperatures above solder liquids for a sufficient time
to get the optimum solder joint quality, whereas overheating the board with its components has to be avoided.
Using infrared ovens without convection special care may be necessary to assure a sufficiently homogeneous
temperature profile for all solder joints on the PCB (especially on large, complex boards with different thermal
masses of the components). The most recommended types are therefore forced convection or vapour phase
reflow. Nitrogen atmosphere can generally improve solder joint quality, but is normally not necessary.
The reflow profiles and other reflow parameters are dependent on the used solder paste. The paste manufacturer
provides a reflow profile recommendation for this product.
Additionally it is important not to overheat the PAN1322 module by a too large reflow peak temperature. PAN1322
contain several plastic packages and is there by sensitive of the moisture content level at the time of board
assembly.
Overheating in combination with excessive moisture content could result in package delaminations or cracks
(popcorn effect). The heating rate should not exceed 3°C/s and max sloping rate should not exceed 4°C/s.
PAN1322 shall be handled according to MSL3, which means a floor life of 168h in 30°C/60% r.h.
The PAN1322 module can be soldered according to max. J-STD-020C curve, assuming that all other conditions
are followed stated in Product Specification, Qualification Report and in Application Note. Restriction is that
PAN1322 can be soldered two times, since one time is already consumed when soldering devices on Module.
10.6
Rework
10.6.1
Removal Procedure
1. Heat the module with an appropriate heating nozzle according to the instruction of the equipment or on a hot
plate (about 225°C dependent on the board). Hot plate can only be used if the board is single side assembled.
The temperature of the module shall be 200-220°C.
2. Use grippers or a pair of tweezers to remove the module. The module has to be gripped on two opposite edges
of the module (not on the shield).
3. Remove excess solder by using solder sucker, suction soldering irons or solder wick.
10.6.2
Replacement Procedure
Replacement can be done in two ways, dependent of how the solder is applied. Solder can be applied either by
dispensing on the mother board or by printing the solder paste directly on the module.
10.6.2.1 Alternative 1: Dispensing Solder
A dispenser with controlled volume must be used to assure the same volume on every pad. The volume on each
pad shall be about 0.04 mm
3
.
1. Dispense 0.04 mm
3
on each LGA pad
2. Pick the module by a nozzle and place in the right position on the board
3. Reflow the solder.
