2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ES device).
4
DMR-EH67GN / DMR-EH67GC / DMR-EH67GCS
Summary of Contents for DMR-EH67GC
Page 5: ...2 2 Precaution of Laser Diode 5 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 8: ...4 Specifications 8 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 9: ...9 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 10: ...5 Location of Controls and Components 10 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 11: ...11 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 13: ...6 1 2 When the Forcible Disc Eject can not be done 13 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 29: ...9 2 P C B Positions 29 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 39: ...10 1 3 Checking and Repairing of Main P C B 39 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 40: ...10 1 4 Checking and Repairing of HDD 40 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 44: ...44 DMR EH67GN DMR EH67GC DMR EH67GCS ...
Page 70: ...DMR EH67GN DMR EH67GC DMR EH67GCS 70 ...
Page 89: ...15 1 2 Packing Accessories Section 89 DMR EH67GN DMR EH67GC DMR EH67GCS ...