DISASSEMBLY PROCEDURES
CONTENTS
1. Removal of Mounting Unit................................................................ DIS-1
2. Removal of Microphone Holder ....................................................... DIS-1
3. Removal of Eyepiece Rubber .......................................................... DIS-1
4. Removal of Eyepiece Unit................................................................ DIS-2
5. Removal of Upper Cover ................................................................. DIS-2
6. Removal of CRT Unit....................................................................... DIS-2
7. Removal of SUB 1 Board................................................................. DIS-3
8. Removal of SUB 2 Board................................................................. DIS-3
9. Removal of MAIN Board .................................................................. DIS-3
Removal
of
Guard
Bar ................................................................... DIS-3
Removal of LED Board .................................................................. DIS-4
Removal of Back-tally Base ........................................................... DIS-4
11.
12.
10.
